More information about IME

IME is a technology that combines the traditional in-mold decoration (IMD) process with electronic printing, etc., generally printing high-performance electronic paste on the IMD film, concentrating various electronic components such as touch control on a single component to make a smart surface. The advantage is that the product can be thin-walled. The products made by the IME process generally have both decorative beauty and electronic functionality, and are also one of the key technologies for the development of intelligent surfaces such as automobiles, home appliances, and medical treatment.

【 Process introduction 】

IME (In-Mold Electronics) is a combination of traditional in-mold (IMD) technology and flexible printed circuits. Is the line printing, SMT mounting (electronic components: LED lights, resistors, capacitors, sensors, chip IC, etc.), high pressure molding, injection molding integrated as one of the intelligent surface technology. The obtained IME control switch can accurately control all functions, and the weight is reduced by nearly 60% compared with the original mechanical switch, achieving the goal of lightweight. This technology can be widely used in automobiles, home appliances, consumer electronics, medical devices and other fields.

【 Technical difficulties of IME 】

The advantages of in-mode electronics are many, including: lightweight, space saving, rugged, faster to market, and high throughput processing capacity. However, this technology is not without disadvantages, such as: shape limitations, yield, immature software, environmental stability, and post-processing problems.

Because IME needs to print and bond the lines and electronic components to the film, the temperature resistance of the film is generally lower than 140°C, and the welding temperature of electronic components and wire pads through the solder paste should exceed 170°C.

Using conductive adhesive to bond electronic components and lines has low solder joint strength and low production efficiency;

After the electronic components are attached to the film, it is easy to stratify, blister and inking after high pressure stretch molding and high temperature and high pressure injection molding.

【IME Products 】